TTTC's Electronic Broadcasting Service

TTTC's Electronic Broadcasting Service

IEEE International Workshop on Defects, Adaptive Test, Yield and Data Analysis
(DATA 2017)
Will be held in conjunction with ITC 2017 - November 2-3, 2017
Fort Worth, TX, USA

http://DATA.tttc-events.org/

CALL FOR PAPERS AND PARTICIPATION 

Scope

THEME: “Data in the Product Lifecycle”

In test, we use data every day. Yield data, throughput data, statistical data, reliability data, outlier data, general production data are all in everyday use. However, data means much more than that. Advances in our industry allow data from wafer fab to be reused in studying system level test results. Field failure studies now routinely uses wafer probe data to understand root cause. Data has now become a product life cycle requirement—cradle to grave. Today access to the data has become an issue; the control and sharing of data among business partners. How to efficiently process data to extract the golden nuggets of useful information amid the gigabytes of unimportant noise remains a focus and a challenge for test professionals.

The Organizing Committee for the DATA-2017 Workshop is soliciting papers in: semiconductor test, yield analysis, product learning, and quality improvement. Of particular interest are advanced techniques and new tools for the use of data during the entire product life cycle, with special attention to how data can be used to change and alter test flows and decisions (adaptive test). Preference will be given to real-world case studies.

Ideas or proposals for Embedded Tutorials, Debates, Panel Discussions and Poster style “Spot-Light” presentations describing industrial experiences or research are also invited.

Suggested Topics

  • Real Time Analysis Methods
  • Real Time Test Process Monitoring
  • Yield Learning and Analysis
  • Analog Fault modeling and coverage
  • Analog effects in Digital Logic
  • Embedded Instrumentation (iJTAG)
  • Advanced dppm reduction & reliability improvement techniques
  • Data Acquisition & Transport
  • Adaptive Test for Product Engineers
  • Data Analysis methods, including multivariate data
  • Fault Localization and Diagnosis
  • Data storage and security
  • I/O Test, Tuning, and Adjustment
  • Product and Project Case studies

Submissions

To present at the workshop, send to Smith.Wesley@Siemens.com a PDF version of an extended abstract or a full paper (Max 10 pages, double column, 11pt font size, IEEE proceeding format) by September 20, 2017. Each submission should include full name and address of each author, affiliation, telephone number, FAX and Email address. Camera-ready papers for inclusion in the digest of papers will be due on October 23, 2017.

Key Dates

Submission Date: September 20, 2017

Notification of Acceptance: October 2, 2017

Camera Ready Paper (.pdf): October 16, 2017

Final Presentation Slides (.ppt): October 23, 2017

Additional Information

General Information:

Jeffrey L Roehr

Independent Test Consultant

E-mail: JLRoehr@Gmail.com

Technical Program Submissions:

Wesley Smith

Mentor, a Siemens Company

E-mail: Smith.Wesley@Siemens.com


Committee

GENERAL CHAIR

  • Jeffrey Roehr, Test Consultant 

PROGRAM CHAIR

  • Wesley Smith, Mentor 

FINANCE CHAIR

  • Sagar Kekare, KLA-Tencor 

PUBLICITY & WEB CHAIR

  • Sankaran Menon, Intel 

PUBLICATIONS CHAIR

  • Chintan Patel, UMBC 

PANEL CHAIR

  • Anne Meixner, The Engineers' Daughter LLC 

LOCAL ARRANGEMENTS

  • David Park, Optimal+ 

TEST STANDARDS CHAIR

  • Al Crouch, SiliconAid

EU LIAISON

  • Dirk DeVries, Qualtera 

STEERING COMMITTEE

  • Jeffrey Roehr, Test Consultant
  • Jennifer Dworak, SMU
  • Sankaran Menon, Intel
  • Adit Singh, Auburn Univ.
  • H. Tehranipoor, U of Florida
  • Hank Walker, Texas A&M
  • Hans Manhaeve, Q-Star Test
  • Jim Plusquellic, U. NM

PROGRAM COMMITTEE

  • Rob Aitken, ARM
  • Nemat Bidokhti, Huawei
  • Sreejit Chakravarty, Intel
  • John Carulli, Global Foundries
  • Patrick Girard, LIRMM, France
  • Ajay Khoche, Smart Connect
  • Mike Laisne, dialog Semi
  • Amit Nahar, Texas Inst’s
  • Suriyaprakash Natarajan, Intel
  • Jay Orbon, Consultant
  • John Potter, Global Foundries
  • Rajesh Raina, NXP
  • Claude Thibeault, ETS, Canada
  • Li C. Wang, UCSB
  • Xiaoqing Wen, KIT, Japan
  • Qiang Xu, CUHK, Hong Kong

For more information, visit us on the web at: http://DATA.tttc-events.org/

DATA 2017 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com


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